Laser perforation is a technology that enables processing by utilising the high energy density of lasers. It can make holes in a variety of materials, such as metal, plastic, paper and so on. Among them, the most common is the technology for making arbitrary drilling patterns on circuit boards at high speed.

The principle of laser drilling technology is to use a high-energy laser beam to focus on the surface of the material, so that the molecules on the surface of the material are heated, melted and evaporated, thus forming a small hole. The precision of laser perforation is very high and can reach micron or even nanometre level.

The advantages of laser perforation technology lie in its high efficiency, cleanliness and repeatability. It can complete the processing of small holes that are difficult to complete with traditional mechanical processing, especially suitable for the need to make holes in special areas. At the same time, the laser drilling technology also has a short opening time, beam focusing energy density and other advantages.

In practice, laser drilling technology can be used to manufacture a variety of precision parts, such as micro electronic components, medical equipment, aerospace equipment.

In addition, laser drilling technology can also be used to manufacture high-precision moulds, such as automotive parts processing technology used in femtosecond laser ultra-precision hole-making equipment. The equipment processing efficiency is greatly improved, higher precision, cost reduction of one-third, is expected to enhance the localisation of key automotive spare parts.

In general, laser perforation technology is a very important precision processing technology, which has a wide range of application prospects in many fields.